Capability

PSC Technology Roadmap
 
A) Technology Roadmap for HDI
Out Layer Line/ Space Width Min. 35um /35um
Line to Pad ≧75um
Pad to Pad ≧ 100 um
Pad to Edge ≧ 150 um
Line WidthTolerance Normal Line± 20%
Impendence Line± 10%
Any Layer Blind Via Size Min. 75 um
Filling Capacity + 5 um / -10 um
Rate of Blind Via Max. 1.0
HDI stacked via 4 Stacks
HDI layers 4+N+4
HDI any layer via 12 layers

B.) Technology Roadmap for HLC
Process step Items Current status Technology  Readiness
E/2024
Board Dimension Max. Board Thickness (mm) 3.2 3.2
Min. Board Thickness(Multilayer) (mm) 0.4 0.4
Max. Panel Dimension (inch) - Multi layer 20x24 20x24
Max.Finished Board size (inch) - Multi layer 18x20 18x20
Inner Layer Min. Trace Width / Space(mil) - H oz. copper thickness 2.5/2.5 2.5/2.5
Max. Copper Weight (oz.) 4 4
Min. Core Thickness (mil) 3 3
Lamination Layer Count 24 24
Layer to Layer Registration (+/- mil) 4 4
Drilling Min. Drill size (Plated Hole) (mil) 8 8
Min. Hole to Hole Pitch 40 40
Plating Aspect Ratio 10:1 10:1
Outer Layer Trace Width / Space (mil) - 1 oz. copper thickness 2.5/2.5 2.5/2.5
Finished Trace Copper Thickness (oz.) 14 (UL Certification: 5oz, D/S 6 oz) 14 (UL Certification: 5oz, D/S 6 oz)
Solder Mask Solder Mask Dam Width 3 3
Solder Mask Registration Tolerance (+/- mil) 2 2
Routing Depth Control Routing Yes Yes
Testing Smallest SMT Pitch 10 10
Smallest BGA Pitch 32 32

C.) Technology Roadmap for DBC
Substrate Material Thickness
Ceramic Al2O3/ AlN* 0.32 /0.38 /0.635 mm
Copper OFC 0.3 /0.4 /0.5 mm
Space/ Line Width Copper thickness Min. S / L Width
0.30 mm 0.45 / 0.45 mm
0.40 mm 0.55 / 0.55 mm
0.50 mm 0.65 / 0.65 mm
Distant from Copper Edge to Ceramic Edge Copper thickness Distant& Tolerance
0.30 mm ≧0.30 ±0.15 mm
0.40 mm ≧0.40 ±0.15 mm
0.50 mm ≧0.50±0.15 mm
Dimple Copper thickness Diameter
0.30 mm 0.60 ±0.1 mm
0.40 mm 0.70 ±0.1 mm
0.50 mm 0.80 ±0.1 mm
Copper peel strength Al2O3＞50 N/cm；A1N＞40 N/cm
Void diameter ≦φ2 mm @front；≦φ3 mm@back
Void area ≦ 5%

D.) Metal Core PCB
Process step Items Current status Technology  Readiness
E/2024
Material for Metal core PCB Aluminum Type : 5052 / 6061 / 1100 / 1050 series Yes Yes
Copper Type ： C1100 Yes Yes
Metal substrat thickness： Max. Thickness: (mm) 3.2 3.2
Metal substrat thickness： Min. Thickness: (mm) 0.15 0.15
Thermal conductivity Prepreg
coeficient of thermal conductivity：0.6W/mk (FR4+Metal) Yes Yes
coeficient of thermal conductivity：1, 2, 3, 5, 8 w/mk Yes Yes
Thermal conductivity CEM3 Yes Yes
Design Guide Board Dimension Single Layer： Max. Panel Size (mm) 550x990 550x990
Single Layer：Max. Array Size (mm) 530x970 530x970
Double Layer：Max. Panel Size (mm) 550x720 550x720
Double Layer：Max. Array Size 530x700 530x700
Inner Layer Min.Trace Width/Space(mil)Double Layer 3.5/3.5 3.5/3.5
Max.Copper Weight (oz.) 3 3
Min.. Core Thickness(mil.) 3 3
Lamination Max. Layer Count (Double-sided Multilayer) (w/ T.H) 1+1 1+1
(Double-sided Multilayer) (w/o T.H) 6+6 6+6
Max. Layer Count(one-sided) 6 6
Drill&Plating Min.Plated Hole Size (mil) Double Layer 10 10
Min. Mounting Hole size (mm) (Board Thk. < 0.5 mm) 0.5 0.5
Min. Mounting Hole size (Board Thk. < 0.5 mm) Aspect ratio ≦ 1.36 1.36
Min Punch Hole size (mm) Aspect ratio≦ 1 1
Min. Hole to Hole Pitch (mil) 40 40
Outer Layer Min. Trace Width / Space Singel Layer(1oz.)
Board Length. ≦ 770 mm 2.5/2.5 2.5/2.5
7705/55/5
85020/2020/20
Min. Trace Width/space Double Layer(1oz.) 4/4 4/4
Max. Finished Trace Copper Thickness(1oz.) 5 5
Available Surface Finish (SMT process) ENIG Yes Yes
ENEPIG Yes Yes
Immersion Silver Yes Yes
Silver electric plating Yes Yes
Immersion Tin Yes Yes
H.A.S.L (Lead Free) Yes Yes
OSP Yes Yes
Available Surface Finish (COB process) ENEPIG Yes Yes
Electric Silver plating Yes Yes
ENIG(Au: 10u"↑) Yes Yes
Others Concave cup Yes Yes
Copper bump (Copper base) Yes Yes
Bendable MCPCB Yes Yes
Screw hole tapping Yes Yes
Countersink hole ; Counterboard Yes Yes
Blind drilling Yes Yes
Anodic treatment Yes Yes

E.) Flex & Rigid-Flex PCB
Process step Items Current status Technology  Readiness
E/2024
Polyimide CCL PI , adhesive/adhesiveless CCL , RA/ED copper Yes Yes
Halogen Free PI / Halogen Free-FR4 Yes Yes
High Tg FCCL 　 　
High Frequency CVL & Bonding sheet 　 　
Design Guide Board Dimension Max. Panel Size (inch) 10x16 10x16
Min. Panel Size (inch) 10x8 10x8
Inner Layer Min. Trace Width / Space (mil) 3.5/3.5 3.5/3.5
Max.Copper Weight (oz.) 2 2
Min.Copper Weight (oz.) 1/3 1/3
Max. FCCL Core Thickness (mil) 2 2
Min. FCCL Core Thickness (mil) 0.5 0.5
Lamination Max. Layer Count (Flex) 4 4
Max. Layer Count(Rigid-Flex) 8 8
Drill&Plating Min. Plated Hole Size (mil) 10 10
　 Max. Hole Aspect Ratio 6:1 6:1
Outer Layer Min. Trace Width / Space 3.5/3.5 3.5/3.5
Available Surface Finish ENIG Yes Yes
Immersion Silver Yes Yes
Immersion Tin Yes Yes
OSP Yes Yes
Solder Mask Min. Solder Mask Thickness (mil) 0.4 0.4
Min. Solder Mask Dam Width (mil) 4 4
Routing Punch Tolerance (+/- mm) 0.1 0.1
Routing Tolerance (+/- mm) 0.15 0.15
Others Coverlayer Paste Tolerance (+/- mil) 12 12
Resinforce Paste (+/- mil) 20 20
Adhesive Paste (+/- mil) 20 20

F.) Material for CCL & Prepreg
a.) FR4 PCB
Material Items Current status
FR4 - High Tg  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes
FR4-Lead Free process  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes
Halogen free  Tg = 150℃ Yes
Tg = 170℃ Yes
RF Products
(Low Dk Low Df)		 Isola FR408 FR408HR Yes
IS640 IS680 Yes
I-Tera MT40 Tg = 200℃ Df = 0.0033 Dk3.75 Yes
Astra MT77 Tg = 200℃ Df = 0.0017 Dk3 Yes
Rogers RO4003 / RO4350B / RO4223 / RO4835 Yes
RO3003 ( Teflon ) Dk = 3.0 Yes
TUC TU-872LK TU-883 Yes
TU-933 Yes
PegaClad1(TU-1300 E) Tg = 220℃ Df = 0.0037 Dk3.6 Yes
PegaClad1(TU-1300 N) Tg = 220℃ Df = 0.0037 Dk3.6 Yes
EMC EM-888 Tg = 170℃ Df = 0.0055 Dk3.8 Yes
EM-890 Tg = 170℃ Df = 0.0036 Dk3.0 Yes
EM-890K Tg = 170℃ Df = 0.0024 Dk2.8 Yes

b.) Metal Core PCB
Material Items Current status
Thermal Conductive Prepreg / CCL Bergquis MP MCPCB k=1.3 w/mk Yes
HR( T30.20) MCPCB k=1.3 w/mk Yes
HT MCPCB k=2.2 w/mk Yes
NRK NRA-8 MCPCB k= 1.8 w/mk Yes
NRA-ES1 MCPCB k= 1.7 w/mk Yes
EMC EM-MP prepreg k= 2.0 w/mk Yes
Ventec VT-4A2H prepreg k= 2.2 w/mk Yes
VT-4B MCPCB k= 3.0 5.0 w/mk Yes
PTTC TCP prepreg k= 2.0 3.0 4.0 8.0 w/mk Yes
White colored core Risho CS-3965V Yes
AMC AMC-820WHFE Yes

G.) Available Finish : RoHS compliance
Items Current status
 O.S.P. Yes
Immersion silver ( Mac Dermid )  Yes
Immersion White Tin ( Omikron ) Yes
Lead Free HASL Yes
Electroless Nickel / Immersion gold  Yes
Electroless Nickel / Electroless Padium / Immersion gold  Yes
Carbon ink  ( Peters ) Yes
Peelable Mask ( Peters ) Yes
Silver Plating　　 Yes
Nickel Plating　　 Yes
Gold Finger Plating Yes
Selective Plating : OSP + Gold plating Yes
Selective Plating : OSP + ENIG   Yes
Selective Plating : ENIG+Gold plating Yes