PSC Technology Roadmap
(A)Technology Roadmap for HDI PSC Electronic Group
Process step Items Current status Technology Readiness
E/2009 E/2010 E/2011
HDI Structure 1+N+1(w/o buried via) Yes Yes Yes Yes
1+N+1(w/o buried via) Yes Yes Yes Yes
Lid plating on buried via Yes Yes Yes Yes
Stagger via(L1-2 , L2-3) Sample Yes Yes Yes
Stagger via , Buried via, 4/4 trace , Laser +PP Sample Yes Yes Yes
Skip via(L1-3) Yes Yes Yes Yes
Step via(L1-2-3) No Sample Yes Yes
Design Guide Min. IVH core thickness (mil) Yes Yes Yes Yes
Rigid-Flex Sample Sample Yes Yes
Min. Laser via diameter (mil) 4 4 3 3
Aspect ratio 0.8 0.8 1 1.2

(B) Technology Roadmap for HLC PSC Electronic Group
Process step Items Current status Technology Readiness
E/2009 E/2010 E/2011
Board Dimension Max. Board Thickness(mm) 4 4 5 TBD
Min. Board Thickness(Multilayer)(mm) 0.4 0.4 0.4 0.4
Max. Panel Dimension(inch) 20x24 20x24 21x24 22x24
Max.Finished Board size (inch) 18x20 18x20 19x21 20x22
Inner Layer Min. Trace Width / Space(mil) 4/4 4/4 3/3 2/2
Max. Copper Weight (oz.) 4 4 5 5
Min. Core Thickness (mil) 3 3 2 2
Lamination Layer Count 22 22 26 34
Layer to Layer Registration (+/- mil) 5 5 4 4
Pin Lamination Yes Yes Yes Yes
Drilling Min. Drill size (Plated Hole) (mil) 10 10 8 8
Min. Hole to Hole Pitch 40 40 32 32
Plating Aspect Ratio 8:1 8:1 10:1 10:1
Outer Layer Trace Width / Space(mil) 4/4 4/4 3/3 2.5/2.5
Finished Trace Copper Thickness(oz.) 5 5 8 8
Solder Mask Solder Mask Dam Width 4 4 3.5 3
Solder Mask Registration Tolerance (+/- mil) 3 2 2 1.5
Routing Depth Control Routing Yes Yes Yes Yes
Testing Impedance Control Tolerance (%) +/-10% +/-10% +/-7% +/-7%
Differential Impedance Control Tolerance(%) +/-10% +/-10% +/-7% +/-7%
Smallest SMT Pitch 10 10 10 10
Smallest BGA Pitch 32 32 20 16
Others Buried Capacitance (paste) No No Sample Yes

(C) Material for CCL & Prepreg PSC Electronic Group
Process step Items Current status Technology Readiness
E/2009 E/2010 E/2011
FR4 - High Tg Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
FR4 - Lead Free process Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
Halogen free Tg = 150℃ Yes Yes Yes Yes
Tg = 180℃ Sample Yes Yes Yes
RF production Isola FR408            Tg = 175 °C Yes Yes Yes Yes
                                   Dk = 3.8 Yes Yes Yes Yes
Nelco N4000-13    Tg = 210 °C Yes Yes Yes Yes
                                   Dk = 3.8 Yes Yes Yes Yes
GETek RG200D     Tg = 185 °C Yes Yes Yes Yes
                                   Dk = 4.2 Yes Yes Yes Yes
ML200D                   Tg = 175 °C Yes Yes Yes Yes
                                   Dk = 3.8 Yes Yes Yes Yes

(D)Micro Wave PCB PSC Electronic Group
Process step Items Current status Technology Readiness
E/2009 E/2010 E/2011
ROGERS CCL RO3003 ( Teflon ) Dk = 3.0 Yes Yes Yes Yes
RO4003 / RO4350B / RO4223 Yes Yes Yes Yes
Arlon CCL Diclad 522 / 527 , 870 / 880 , 250GT / 250GX Yes Yes Yes Yes
25N / 25FR (ceramic filled ) Dk = 3.38 / 3.58 Yes Yes Yes Yes
Isola CCL IS640 IS680 Dk = 3.45 Yes Yes Yes Yes
Nelco CCL N4000-13SI Dk = 3.5 Yes Yes Yes Yes

(E)Available Finish : RoHS compliance
Items Current status Technology Readiness
E/2009 E/2010 E/2011
O.S.P. Yes Yes Yes Yes
Immersion silver ( Mac Dermid ) Yes Yes Yes Yes
Immersion White Tin ( Omikron ) Yes Yes Yes Yes
Lead Free HASL Yes Yes Yes Yes
Electroless Nickel / Immersion gold Yes Yes Yes Yes
Carbon ink ( Peters ) Yes Yes Yes Yes
Peelable Mask ( Peters ) Yes Yes Yes Yes
Silver Plating Yes Yes Yes Yes
Gold Finger Plating Yes Yes Yes Yes
Selective Plating : OSP + Gold plating Yes Yes Yes Yes
OSP + ENIG Yes Yes Yes Yes

(F)Metal Core PCB PSC Electronic Group
Process step Items Current status Technology Readiness
E/2009 E/2010 E/2011
Material for Aluminum core PCB Aluminum Type : 5052 / 6061 / 1100 / 1050 series Yes Yes Yes Yes
Max. Aluminum Thickness : ( mm) 4 4 TBD TBD
Min. Aluminum Thickness : ( mm) 0.17 0.15 0.15 0.135
Thermal conductivity Prepreg Type
Thermalgam T-preg 3.0 w/mk Yes Yes Yes Yes
Bergquist CML 1.1 w/mk Yes Yes Yes Yes
TCP-1000 1.5 w/mk Yes Yes Yes Yes
Arlon 99N/ML 1.2 w/mk Yes Yes Yes Yes
NRK NPR-8 1.8 w/mk Yes Yes Yes Yes
DENKA TH-1 4.0 w/mk No Sample Yes Yes
K-1 2.0 w/mk Yes Yes Yes Yes
Design Guide Board Dimension Max. Panel Size (inch) 18x24 19x24 19x24 19x24
Max. Array Size 16x22 17x22 17x22 17x22
Inner Layer Min. Trace Width / Space (mil) 4/4 3/3 3/3 2.5/2.5
Max.Copper Weight (oz.) 3 4 5 5
Min.Copper Weight (oz.) 0.5 0.5 TBD TBD
Max. Core Thickness(mm) 2 2 TBD TBD
Min.. Core Thickness(mil) 4 3 2 2
Lamination Max. Layer Count (Double-sided Multilayer) 6+6 6+6 TBD TBD
Max. Layer Count(one-sided) 4 8 TBD TBD
Drill & Plating Min. Plated Hole Size (mil) 10 10 8 8
Min. Mounting Hole size (mil) 20 20 16 12
Min. Hole to Hole Pitch (mil) 40 40 32 24
Outer Layer Min. Trace Width / Space 4/4 3/3 3/3 3/3
Max. Finished Trace Copper Thickness(oz.) 5 6 8 TBD
Min. Finished Trace Copper Thickness(oz.) 0.5 0.5 0.5 0.5
Available Surface Finish ENIG Yes Yes Yes Yes
Immersion Silver Yes Yes Yes Yes
Immersion Tin Yes Yes Yes Yes
Immersion Nickel Yes Yes Yes Yes
H.A.S.L (Lead Free) Yes Yes Yes Yes
OSP Yes Yes Yes Yes
Solder Mask Min. Solder Mask Thickness (mil) 0.4 0.4 0.4 0.4
Max. Solder Mask Dam Width (mil) 4 4 3 3
Copper Core Copper substrat thickness 0.2 mm , 0.5 mm , 0.8 mm , 1.0 mm Yes Yes Yes Yes
Ferreous (Fe)Core Fe thickness : 0.8 mm Max. Layer Count 1 1 TBD TBD
Prepreg : FR4

(G) Flex & Rigid-Flex PCB PSC Electronic Group
Process step Items Current status Technology Readiness
E/2009 E/2010 E/2011
Polyimide CCL PI , adhesive/adhesiveless CCL , RA/ED copper Yes Yes Yes Yes
Halogen Free PI / Halogen Free-FR4 Yes Yes Yes Yes
High Tg FCCL Sample Yes Yes Yes
Design Guide Board Dimension Max. Panel Size (inch) 10x16 10x16 10x18 10x18
Min. Panel Size (inch) 10x8 10x8 10x8 10x8
Inner Layer Min. Trace Width / Space (mil) 4/4 3/3 2/2 2/2
Max.Copper Weight (oz.) 2 2 3 3
Min.Copper Weight (oz.) 1/3 1/4 1/4 1/4
Max. FCCL Core Thickness (mil) 2 2 2 2
Min. FCCL Core Thickness (mil) 0.5 0.5 0.5 0.5
Lamination Max. Layer Count (Flex) 4 6 8 TBD
Max. Layer Count(Rigid-Flex) 8 12 TBD TBD
Drill & Plating Min. Plated Hole Size (mil) 10 10 8 8
Max. Hole Aspect Ratio 6:1 8:1 8:1 10:1
Outer Layer Min. Trace Width / Space 4/4 3/3 3/3 3/3
Available Surface Finish ENIG Yes Yes Yes Yes
Immersion Silver Yes Yes Yes Yes
Immersion Tin Yes Yes Yes Yes
OSP Yes Yes Yes Yes
Solder Mask Min. Solder Mask Thickness (mil) 0.4 0.4 0.4 0.4
Max. Solder Mask Dam Width (mil) 4 4 3 3
Routing Punch Tolerance (+/- mm) 0.1 0.1 0.1 0.1
Routing Tolerance (+/- mm) 0.2 0.15 0.1 0.1
Others Coverlayer Paste Tolerance (+/- mil) 12 10 8 6
Resinforce Paste (+/- mil) 20 16 12 12
Adhesive Paste (+/- mil) 20 16 12 12


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