 A) Metal Core PCB |
| Process step |
Items |
Current status |
Technology Readiness |
| E/2012 |
E/2013 |
E/2014 |
| Material for Metal core PCB |
Aluminum Type : 5052 / 6061 / 1100 / 1050 series |
Yes |
Yes |
Yes |
Yes |
| |
Max. Aluminum Thickness : ( mm) |
4 |
4 |
4 |
4 |
|
Min. Aluminum Thickness : ( mm) |
0.15 |
0.15 |
0.15 |
0.15 |
| Copper substrat thickness： |
Max. Thickness: (mm) |
4 |
4 |
4 |
4 |
| |
Min. Thickness: (mm) |
0.3 |
0.3 |
0.3 |
0.3 |
| Thermal conductivity Prepreg |
| coeficient of thermal conductivity：1~3 w/mk |
Yes |
Yes |
Yes |
Yes |
| coeficient of thermal conductivity：4 w/mk |
Yes |
Yes |
Yes |
Yes |
| coeficient of thermal conductivity：5 w/mk |
sample |
Yes |
Yes |
Yes |
| Thermal conductivity CEM3 |
Yes |
Yes |
Yes |
Yes |
| Design Guide |
Board Dimension
(Single sided) |
Singel Layer： Max. Panel Size (mm) |
457x680 |
457x680 |
483x680 |
507x680 |
| Max. Array Size (mm) |
427x650 |
427x650 |
453x650 |
477x650 |
| Multi Layer： Max. Panel Size (mm) |
457x610 |
457x610 |
483x610 |
507x610 |
| Max. Array Size |
427x580 |
427x580 |
453x580 |
477x580 |
| Inner Layer |
Min. Trace Width / Space (mil) |
4/4 |
4/4 |
3.5/3.5 |
3/3 |
| Max.Copper Weight (oz.) |
2 |
2 |
3 |
3 |
| Min.Copper Weight (oz.) |
0.5 |
0.5 |
TBD |
TBD |
| Max. Core Thickness(mm) |
2 |
2 |
TBD |
TBD |
| Min.. Core Thickness(mil) |
4 |
4 |
3 |
3 |
| Lamination |
Max. Layer Count (Double-sided Multilayer) |
1+1 |
1+1 |
TBD |
TBD |
| Max. Layer Count(one-sided) |
4 |
4 |
6 |
TBD |
| Drill&Plating |
Min. Plated Hole Size (mil) |
10 |
10 |
8 |
8 |
| Min. Mounting Hole size (mil) |
20 |
20 |
16 |
16 |
| Min. Hole to Hole Pitch (mil) |
40 |
40 |
32 |
24 |
| Outer Layer |
Min. Trace Width / Space |
4/4 |
4/4 |
3.5/3.5 |
3/3 |
| Max. Finished Trace Copper Thickness(oz.) |
5 |
6 |
8 |
TBD |
| Min. Finished Trace Copper Thickness(oz.) |
0.5 |
0.5 |
0.5 |
0.5 |
Available Surface Finish
(SMT process) |
ENIG |
Yes |
Yes |
Yes |
Yes |
| ENEPIG |
Yes |
Yes |
Yes |
Yes |
| Immersion Silver |
Yes |
Yes |
Yes |
Yes |
| Silver electric plating |
Yes |
Yes |
Yes |
Yes |
| Immersion Tin |
Yes |
Yes |
Yes |
Yes |
| Immersion Nickel |
Yes |
Yes |
Yes |
Yes |
| H.A.S.L (Lead Free) |
Yes |
Yes |
Yes |
Yes |
| OSP |
Yes |
Yes |
Yes |
Yes |
| Others |
Concave cup |
Yes |
Yes |
Yes |
Yes |
| Screw hole tapping |
Yes |
Yes |
Yes |
Yes |
| Countersink hole |
Yes |
Yes |
Yes |
Yes |
| Blind drilling |
Yes |
Yes |
Yes |
Yes |
| Anodic treatment |
Yes |
Yes |
Yes |
Yes |
|
|
|
|
| B) Technology Roadmap for HDI |
| Process step |
Items |
Current status |
Technology Readiness |
| E/2012 |
E/2013 |
E/2014 |
| HDI Structure |
1+N+1(w/o buried via) |
Yes |
Yes |
Yes |
Yes |
| 1+N+1(w/o buried via) |
Yes |
Yes |
Yes |
Yes |
| Lid plating on buried via |
Yes |
Yes |
Yes |
Yes |
| Stagger via(L1-2 , L2-3) |
Sample |
Yes |
Yes |
Yes |
| Stagger via , Buried via, 4/4 trace , Laser +PP |
Sample |
Yes |
Yes |
Yes |
| Skip via(L1-3) |
Yes |
Yes |
Yes |
Yes |
| Step via(L1-2-3) |
No |
Sample |
Yes |
Yes |
| Design Guide |
Min. IVH core thickness (mil) |
4 |
4 |
3 |
3 |
| Min. Laser via diameter (mil) |
4 |
4 |
3 |
3 |
| Aspect ratio |
0.8 |
0.8 |
1 |
1.2 |
| C) Technology Roadmap for HLC |
| Process step |
Items |
Current status |
Technology Readiness |
| E/2012 |
E/2013 |
E/2014 |
| Board Dimension |
Max. Board Thickness (mm) |
4 |
4 |
5 |
TBD |
| Min. Board Thickness(Multilayer) (mm) |
0.4 |
0.4 |
0.4 |
0.4 |
| Max. Panel Dimension (inch) |
20x24 |
20x24 |
21x24 |
22x24 |
| Max.Finished Board size (inch) |
18x20 |
18x20 |
19x21 |
20x22 |
| Inner Layer |
Min. Trace Width / Space (mil) |
4/4 |
4/4 |
3/3 |
2/2 |
| Max. Copper Weight (oz.) |
4 |
4 |
5 |
5 |
| Min. Core Thickness (mil) |
3 |
3 |
2 |
2 |
| Lamination |
Layer Count |
22 |
22 |
26 |
34 |
| Layer to Layer Registration (+/- mil) |
5 |
5 |
4 |
4 |
| Pin Lamination |
Yes |
Yes |
Yes |
Yes |
| Drilling |
Min. Drill size (Plated Hole) (mil) |
10 |
10 |
8 |
8 |
| Min. Hole to Hole Pitch |
40 |
40 |
32 |
24 |
| Plating |
Aspect Ratio |
8:1 |
8:1 |
10:1 |
12:1 |
| Outer Layer |
Trace Width / Space (mil) |
4/4 |
4/4 |
3/3 |
2.5/2.5 |
| Finished Trace Copper Thickness (oz.) |
5 |
5 |
8 |
8 |
| Solder Mask |
Solder Mask Dam Width |
4 |
4 |
3.5 |
3 |
| Solder Mask Registration Tolerance (+/- mil) |
3 |
2 |
2 |
1.5 |
| Routing |
Depth Control Routing |
Yes |
Yes |
Yes |
Yes |
| Testing |
Impedance Control Tolerance (%) |
+/-10% |
+/-10% |
+/-7% |
+/-7% |
| Differential Impedance Control Tolerance(%) |
+/-10% |
+/-10% |
+/-7% |
+/-7% |
| Smallest SMT Pitch |
10 |
10 |
10 |
10 |
| Smallest BGA Pitch |
32 |
32 |
20 |
16 |
| Buried Capacitance (paste) |
No |
No |
Sample |
Yes |
| Others |
PSC Technology Roadmap |
PSC Electronic Group |
| Material for CCL & Prepreg |
| A) FR4 PCB |
| Material |
Items |
Current status |
Technology Readiness |
| E/2012 |
E/2013 |
E/2014 |
| FR4 - High Tg |
Tg = 150℃ / 170℃ / 180℃ / 215℃ |
Yes |
Yes |
Yes |
Yes |
| FR4 - Lead Free process |
Tg = 150℃ / 170℃ / 180℃ / 215℃ |
Yes |
Yes |
Yes |
Yes |
| Halogen free |
Tg = 150℃ |
Yes |
Yes |
Yes |
Yes |
| Tg = 180℃ |
Sample |
Yes |
Yes |
Yes |
| RF production |
Isola FR408 Tg = 175 oC |
Yes |
Yes |
Yes |
Yes |
| Dk = 3.8 |
| Nelco N4000-13 Tg = 210 oC |
Yes |
Yes |
Yes |
Yes |
| Dk = 3.8 |
| GeTek RG200D Tg = 185 oC |
Yes |
Yes |
Yes |
Yes |
| Dk = 4.2 |
| ML200D Tg = 175 oC |
Yes |
Yes |
Yes |
Yes |
| Dk = 3.8 |
| B) Metal Core PCB |
| Material |
Items |
Current status |
Technology Readiness |
| E/2012 |
E/2013 |
E/2014 |
| Thermal Conductive Prepreg / CCL |
Laird 1KA |
prepreg k= 3 w/mk |
Yes |
Yes |
Yes |
Yes |
| Arlon 92ML |
prepreg k= 2 w/mk |
Yes |
Yes |
Yes |
Yes |
| NRK NRA-8 |
prepreg k= 1.8 w/mk |
Yes |
Yes |
Yes |
Yes |
| NRA-ES1 |
prepreg k= 1.7 w/mk |
Yes |
Yes |
Yes |
Yes |
| EMC EM-MP |
prepreg k= 2.0 w/mk |
Yes |
Yes |
Yes |
Yes |
| EM-M1 |
prepreg k= 3.0 w/mk |
Yes |
Yes |
Yes |
Yes |
| NAN YA NPRCHA |
prepreg k= 3.0 w/mk |
Yes |
Yes |
Yes |
Yes |
| NPRTHB |
prepreg k= 2.0 w/mk |
Yes |
Yes |
Yes |
Yes |
| CEM-3-09HT |
CEM3/CCL k= 1.0 w/mk |
Yes |
Yes |
Yes |
Yes |
| PTTC TCP-2 |
prepreg k= 2.0 w/mk |
Yes |
Yes |
Yes |
Yes |
| TCP-4 |
prepreg k= 4.0 w/mk |
Yes |
Yes |
Yes |
Yes |
| B) Micro Wave PCB |
| Process step |
Items |
Current status |
Technology Readiness |
| E/2012 |
E/2013 |
E/2014 |
| ROGERS CCL |
RO3003 ( Teflon ) Dk = 3.0 |
Yes |
Yes |
Yes |
Yes |
| RO4003 / RO4350B / RO4223 |
Yes |
Yes |
Yes |
Yes |
| Arlon CCL |
Diclad 522 / 527 , 870 / 880 , 250GT / 250GX |
Sample |
Yes |
Yes |
Yes |
| 25N / 25FR (ceramic filled ) Dk = 3.38 / 3.58 |
Yes |
Yes |
Yes |
Yes |
| Isola CCL |
IS640 IS680 Dk = 3.45 |
Yes |
Yes |
Yes |
Yes |
| Nelco CCL |
N4000-13SI Dk = 3.5 |
Yes |
Yes |
Yes |
Yes |
| F) Available Finish : RoHS compliance |
| Items |
Current status |
Technology Readiness |
| E/2012 |
E/2013 |
E/2014 |
| O.S.P. |
Yes |
Yes |
Yes |
Yes |
| Immersion silver ( Mac Dermid ) |
Yes |
Yes |
Yes |
Yes |
| Immersion White Tin ( Omikron ) |
Yes |
Yes |
Yes |
Yes |
| Lead Free HASL |
Yes |
Yes |
Yes |
Yes |
| Electroless Nickel / Immersion gold |
Yes |
Yes |
Yes |
Yes |
| Electroless Nickel / Electroless Padium / Immersion gold |
Yes |
Yes |
Yes |
Yes |
| Carbon ink ( Peters ) |
Yes |
Yes |
Yes |
Yes |
| Peelable Mask ( Peters ) |
Yes |
Yes |
Yes |
Yes |
| Silver Plating |
Yes |
Yes |
Yes |
Yes |
| Nickel Plating |
Yes |
Yes |
Yes |
Yes |
| Gold Finger Plating |
Yes |
Yes |
Yes |
Yes |
| Selective Plating : OSP + Gold plating |
Yes |
Yes |
Yes |
Yes |
| OSP + ENIG |
Yes |
Yes |
Yes |
Yes |
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